Encyclopaedia Index

TITLE : Thermal interface under a PQFP.

BY : CHAM Development Team - Sergei Zhubrin

DATE : 1999

FOR : Demonstration case



The single PQFP is mounted on the conducting PCB. The heat generating in PQFP is dissipated by natural convection.

The conductive thermal interface layer is introduced underneath of heat-dissipation plastic object.

The purpose of the case is to find out how the temperature distribution is affected by the presence of an interface. The parametric studies can also be made to show how the interface conductivity would influence the temperature difference between the component and PCB.

Pictures are as follows :