TITLE : Thermal performance of populated PCB in a swirling flow
BY : CHAM Development Team - Sergei Zhubrin
DATE : 1999
FOR : Demonstration case
PHOENICS version: HOTBOX-99
This case models the heat dissipation from a PCB with six PQFP mounted
on it. The swirling flow entering the wind tunnel takes out the heat providing
the cooling. Results show boundary layer developing on the solid surfaces
and hot plume moving upwards. Turbulence is modelled using the k-e model.
Note that the LVEL turbulence model is recommended for HOTBOX simulations,
this case shows that the k-e model is an option.
Pictures are as follows :