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TITLE : Thermal performance of populated PCB in a swirling flow

BY : CHAM Development Team - Sergei Zhubrin

DATE : 1999

FOR : Demonstration case



This case models the heat dissipation from a PCB with six PQFP mounted on it. The swirling flow entering the wind tunnel takes out the heat providing the cooling. Results show boundary layer developing on the solid surfaces and hot plume moving upwards. Turbulence is modelled using the k-e model.

Note that the LVEL turbulence model is recommended for HOTBOX simulations, this case shows that the k-e model is an option.

Pictures are as follows :