Encyclopaedia Index
TITLE : AIR-WATER FLOW THROUGH COOLING MODULE
BY : CHAM Development Team
DATE : 2023
FOR : Demonstration case
PHOENICS version: HOTBOX-2022
DETAILS :
For the high power dissipation densities the liquid cooling should be considered.
The case represents counter-current Air\Water Flow Through module. The
PCB with FQFP mounted on is cooled down by forced air flow from one side
and by forced water flow from the other. The heat generated by the electronic
component, FQFP, is transfered both into the gas and by conduction through
the board into water flow.
Pictures are as follows :
