Encyclopaedia Index

TITLE : AIR-WATER FLOW THROUGH COOLING MODULE

BY : CHAM Development Team - Sergei Zhubrin

DATE : 1999

FOR : Demonstration case

PHOENICS version: HOTBOX-99

DETAILS :

For the high power dissipation densities the liquid cooling should be considered. The case represents counter-current Air\Water Flow Through module. The PCB with FQFP mounted on is cooled down by forced air flow from one side and by forced water flow from the other. The heat generated by the electronic component, FQFP, is transfered both into the gas and by conduction through the board into water flow.

Pictures are as follows :