TITLE : Forced convection cooling of electronics in a tower rack

BY : CHAM Development Team

DATE : 2023

FOR : Demonstration case

PHOENICS version: HOTBOX-2022

DETAILS :

The front door of the enclosure is perforated at two levels to allow ambient air to enter. The roof is also perforated to allow the heated air to leave.

Angled baffle plate is placed between sub-racks, so as to ensure that fresh, ambient air is sucked-in by the fans mounted on the horisontal plate above.

Horisontal baffle plate is also placed under the lower sub-rack housing 6 fans sucking the fresh, ambient air through the aperture.

Electronic components generate heat and simulation is carried out to locate the hot spots.

Pictures are as follows :

• Geometrical layout and air flow distribution.
• Air flow paths.
• Velocity vectors at different planes.
• Velocity vectors at X-plane.
• Temperature contours at X-plane.
• Velocity vectors at Z-plane.
• Temperatures at Z-plane of hot spot.
• Velocity vectors at Z-plane of hot spot.
• iso-surface of velocity coloured by temperature showing transient fluttering.