Encyclopaedia Index

 

TITLE : A composite model of a PQFP

BY : CHAM Development Team - Sergei Zhubrin

DATE : 1999

FOR : Demonstration case

PHOENICS version: HOTBOX-99

Details:

In this case the cooling air from the fan flows over PCB/PQFP/heat sink assembly.

The composite multi-layer model is used to represent the the assembly structure and related thermal resistances.

Pin fin heat sink is represented as the porous domain fluid object with linear heat source.

Pictures are as follows :