Encyclopaedia Index


TITLE : Recirculating cooling of a package

BY : CHAM Development Team - Sergei Zhubrin

DATE : 1999

FOR : Demonstration case



The case illustrates the simulation of recirculating (extract and supply) cooling of PCB (mother board) - fin heat connector - module (daughter board) with heat sink combination.

Pin fin heat connector is represented as the porous domain fluid object of highly anisotropic conductivity.

Heat sink (spreader device) at the top of daughter board is simulated as the porous domain fluid object with linear heat and quadratic momentum sources.

Pictures are as follows :