APPLICATIONS of HOTBOX-99
- Compact modelling examples.
- System level analysis for electronics enclosures and their contents.
- Printed Circuit Boards analysis for thermal behaviour within PCB and its interaction within the colling air.
- Packaging level analysis of electronic components with internal structure and with attached heat sinks and interaction with cooling air.
- Component level: performance analysis of the single component models.
- Environment level analysis of surrounding effects on thermal performance.
- Efficient cooling techniques for high power dissipation units.
1. Compact modelling examples
- Planar sources attached to conductive board
- Heat sink/planar sources on an anisotropic PCB
- A composote model of a Plastic Quad Pack
- Recirculating cooling of a package
- Closed circuit cooling
- A simple model of laptop design
3. System level analysis
- Forced convection cooling of an electronic tower rack.
- Convective cooling of a telephone exchange unit
- Thermal analysis of PC desktop enclosure
- Heat and air flow distribution in a system rack.
- Simulation of remote base-station diagnostic system
- Simulation of electronics-assembly cooling
3. PCB level analysis
- Natural cooling of PQFP array.
- An assembly of six PQFP in an angled flow
- Populated PCB in a swirling flow.
- Counter-current AFT module with heat sink
- Fine-grid embedding for simulation of AFT module
- Cooling of two fully populated PCB's: smoke test.
- Heat transfer in an experimental electronics cabinet.
- Circuit board cooling in an electronics cabinet
4. Packaging level analysis
5. Component level analysis
- 3D model of a Plastic Quad Flat Pack.
- The effect of enclosure orientation on heat dissipation.
- Natural cooling of PQFP in an enclosure
- Thermal interface under a plastic quad flat pack.
- Typical quad flat pack on PCB in a wind channel
- Optimization of air flow in a mini-environment
6. Environment level analysis
- Internals and surroundings of an electronics unit.
- Cooling of the electronic unit by heat sink
- Modelling of a table top control box.
7. Cooling techniques for high power dissipation units